CPF

COMPONENT PRINT FRAME

CPF Process

The CPF (Component Print Frame) was designed to ensure accurate solder paste deposition onto the balls of the BGA. Because the CPF prints paste onto the BGA, there are no keep out or clearance issues with adjacent component on the PCB.

For more information and pricing contact us.

 

 

 

 

 

 

 

 

 


Accessories Solder Balls
Flip-Up CPF