Flip-Up

STENCILS
1000s in Stock Fast Turn Customs
Specify: Pattern, Aperture Thickness, Text and Pitch

Designed to be used with the MSP 100/300/400 and SH-1 Printers, The Flip-Up Stencils can be made in BGA, QFP, PLCC, SOIC, and connector patterns.

If you would like more information, have any questions, or would like to request a quote on Mini Micro Single Site Flip UP Stencils, please contact us.


Accessories Solder Balls
Flip-Up CPF