Mini Micro Stencil, Inc. has been the industry leader in the design and development of tools, equipment and process for rework and repair of electronic components and assemblies.  This knowledge has been put to work in our contract rework and repair facility for the past 10+ years.  Our experience results in consistent, reliable and high quality rework in all aspects of BGA/QFN rework, re-balling and X-ray inspection.

BGA removal

• Site preparation
• Pad repair
• Trace repair

BGA placement

• lead-free capabilities
• Precise optical alignment
• Accurate monitored profiles

BGA re-balling

• Lead to lead
• Lead-free to lead
• Lead to lead-free

X-ray & optical inspection

• 100% X-ray inspection
• Endoscopic perimeter inspection

Baking & Sealing

• Drive out damaging moisture
• Sealed in moisture barrier bags with desiccant

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